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SPECIFICATION
PART NO. : MT2003L-WR 3.0mm ROUND LED LAMP
ATTENTION
OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES
Approved by
Checked by
Prepared by
Tung
Yang
Min Bao
MT2003L-WR
Description
3.0mm ROUND LED LAMP
This warm white lamp is made with InGaN/Sapphire chip and white diffused epoxy resin.
3.0
1.0
4.1 0.5 MAX. 2.540.1
A K
Notes: 1. All dimensions are in mm. 2. Tolerance is 0.25mm unless otherwise noted.
Description
LED Chip Part No.
Material MT2003L-WR InGaN/Sapphire Emitting Color Warm White White diffused
1.5 TYP.
24.0 MIN.
5.1
Lens Color
VER.: 01
Date: 2007/11/27
Page: 1/6
MT2003L-WR
Absolute Maximum Ratings at Ta=25
Parameter
Power Dissipation Reverse Voltage D.C. Forward Current Reverse (Leakage) Current Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature(1.6mm from body) Electrostatic discharge
3.0mm ROUND LED LAMP
Symbol
PD VR If Ir If(Peak) Topr. Tstg. Tsol. ESD.
Rating
120 5 30 50 100 -25 to +85 -40 to +100 Dip Soldering : 260 Hand Soldering : 350 6000
Unit
mW V mA A mA
for 5 sec. for 3 sec. V
Electrical and Optical Characteristics:
Parameter
Luminous Intensity Forward Voltage Correlated Colour Temperature Reverse (Leakage) Current Viewing Angle 2
Symbol
IV Vf CCT Ir 1/2 Notes:
Condition
If=20mA If=20mA If=20mA Vr=5V If=20mA
Min.
1520
Typ.
1800 3.2
Max.
Unit
mcd
4.0 3500 50
V
o
3000
K
A deg
65
The datas tested by IS tester.
2. Customer's special requirements are also welcome.
VER.: 01
Date: 2007/11/27
Page: 2/6
MT2003L-WR
Typical Electrical / Optical Characteristics Curves :
3.0mm ROUND LED LAMP
Relative Response
Wavelength(nm)
WHITE LED SPECTRUM VS. WAVELENGTH
50 40 30 20 10
2500
Relative Luminous Intensity
Forward Current IF(mA)
2000 1500 1000 500 0.0 10.0 20.0 30.0
2.0
2.6
3.0
3.4
3.8
4.2
Forward Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE
Forward Current (mA)
FORWARD CURRENT VS. LUMINOUS INTENSITY
50 40
0
10
20 30
Forward Current IF(mA)
40
30
1.0 50 60 70 80 90 0.5 0.3 0.1 0.2 0.4 0.6
20 10
0.9 0.8
0.7
0
20 40 60 Temperature ( )
80
100
FORWARD CURRENT VS. AMBIENT TEMPERATURE
RADIATION DIAGRAM
VER.: 01
Date: 2007/11/27
Page: 3/6
MT2003L-WR
Specifications for Bin Grading: BIN U V Iv(mcd) MIN. 1520 2130
3.0mm ROUND LED LAMP
MAX. 2130 3000
Specifications for Vf Group: Group V7 V8 V9 V10 V11 V12 Vf(V) MIN. 2.8 3.0 3.2 3.4 3.6 3.8 MAX. 3.0 3.2 3.4 3.6 3.8 4.0
Specifications for Colour Temperature Group: CCT (oK) @20mA MIN. 3000 3100 3200 3300 3400 MAX. 3100 3200 3300 3400 3500
VER.: 01
Date: 2007/11/27
Page: 4/6
MT2003L-WR
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use
3.0mm ROUND LED LAMP
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 .
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip soldering : Pre-heat: 90 max. (Backside of PCB), Within 60 seconds. (Solder temperature), Within 5 seconds. max. (Temperature of soldering iron tip), Within 3 seconds.
Solder bath: 260 5 (3) Hand soldering: 350
3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same. 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 max. Baking time: Within 60 seconds.
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature.
VER.: 01
Date: 2007/11/27
Page: 5/6

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